THE BEST WAY TO Water-Soluble SOLDER PASTES USING ROSIN-BASED FLUXES

Evaluation of Water Soluble and No-Clean Solder Pastes with Palladium Plated and Solder Plated SMT Devices

In response to increasing environmental concern over the use of chlorofluorocarbons (CFC's) to clean printed circuit assemblies, many surface mount operations are converting to water soluble or no-clean type solder pastes. Current trends indicate that this conversion will progress rapidly until water soluble and no-clean pastes constitute the majority of the product mix. With the introduction o...

Controlling health risks from rosin (colophony) based solder fluxes - indg249

Reliability Study of Low Silver Alloy Solder Pastes

Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. ...

Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag Alloys

• Share with a friend Dr. Ning-Cheng Lee, Vice President of Technology, Indium Corporation, is a world-renown soldering expert and an SMTA Member of Distinction. He has nearly 30 years of experience in the development of fluxes and solder pastes for SMT industries. He has extensive experience in the development of high temperature polymers, encapsulants for microelectronics, underfills, and adh...

Lead-free Solder Assembly

Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...